Electroplating additives are chemical additives used in the electroplating process that can enhance the effect of electroplating and improve the quality and uniformity of the coating.
Author: Marisa
Electroplating additives are chemical additives used in the electroplating process that can enhance the effect of electroplating and improve the quality and uniformity of the coating.
Electroplating additives usually contain organic and inorganic substances. By adding an appropriate amount of additives to the electrolyte, the current in the electroplating process can be changed.
density distribution and deposition rate, thereby achieving better electroplating results.
Commonly used electroplating additives are mainly divided into the following categories:
Brightener: Improve the brightness and bonding strength of the coating. For example, sodium lauryl sulfate (K-12), hexadecyl trimethyl betaine (Am), etc.
Leveling agent: Provides leveling performance for the plating solution and improves brightness and leveling performance in low current areas.
Moving agent: enables the plating solution to reach all parts of the plated parts.
Softener: Reduces the brittleness of the coating and is a primary brightener.
Degreaser: Removes oil and dirt from metal surfaces.
Stabilizer: Prevents the main salt in the plating solution from hydrolyzing or the metal ions from oxidizing, keeping the solution clear and stable.
Complexing agent: makes the insoluble metals more soluble in water.
Wetting agent: Reduce the surface tension of the coating and prevent pinholes.
Leveling agent: Make the coating crystallize finely and obtain a smooth coating.
Wetting agent: reduce the surface tension of the plating solution, make hydrogen escape easily, and reduce pinholes
Classification and function of electroplating additives:
Brightener: Improve the brightness and bonding strength of the coating.
Leveling agent: Provides leveling performance for the plating solution and improves brightness and leveling performance in low current areas.
Moving agent: enables the plating solution to reach all parts of the plated parts.