DIP (dual in-line package) components have standard dimensions that comply with JEDEC standards. The distance between two pins (pitch) is 0.1 inches (2.54 mm). The row spacing, which refers to the distance between two rows of pins, depends on the number of pins in the package. The most common row spacings are 0.3 inches (7.62 mm) or 0.6 inches (15.24 mm). Other less common spacings are 0.4 inches (10.16 mm) or 0.9 inches (22.86 mm). There are also some packages with a pitch of 0.07 inches (1.778 mm) and row spacings of 0.3 inches, 0.6 inches, or 0.75 inches.
DIP packages used in the former Soviet Union and Eastern Europe are similar to JEDEC standards, but the pitch is 2.5 millimeters, which is based on the metric system, rather than 0.1 inches (2.54 mm) used in the imperial system.
The number of pins in a DIP package is always even. If the row spacing is 0.3 inches, the most common number of pins is from 8 to 24, and sometimes there are packages with 4 or 28 pins. If the row spacing is 0.6 inches, the most common numbers of pins are 24, 28, 32, or 40, and there are also packages with 36, 48, or 52 pins. The maximum number of pins for commonly used DIP packages is 64, as in the case of the Motorola 68000 and Zilog Z180 CPUs.
When the identifying notch of a component is facing up, the upper-left pin is pin 1, and the other pins are numbered counterclockwise. Sometimes pin 1 is also marked with a dot. For example, in a DIP14 IC, when the identifying notch is facing up, the pins on the left side are numbered from 1 to 7 from top to bottom, and the pins on the right side are numbered from 8 to 14 from bottom to top.
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